专利名称：Bowl-shaped solder structure发明人：Cyprian Emeka Uzoh,Rajesh Katkar申请号：US14754293申请日：20150629
公开号：US20150303157A1公开日：20151022
专利附图：
摘要：An apparatus relating generally to a substrate is disclosed. In this apparatus, afirst metal layer is on the substrate. The first metal layer has an opening. The opening ofthe first metal layer has a bottom and one or more sides extending from the bottom. Asecond metal layer is on the first metal layer. The first metal layer and the second metal
layer provide a bowl-shaped structure. An inner surface of the bowl-shaped structure isdefined responsive to the opening of the first metal layer and the second metal layerthereon. The opening of the bowl-shaped structure is configured to receive and at leastpartially retain a bonding material during a reflow process.
申请人：Invensas Corporation
地址：San Jose CA US
国籍：US
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容