专利名称：Heat insulating board and method for heat
insulation by using the same
发明人：Yumiko Kujirai,Masami Kujirai,Yukio Kujirai申请号：US08/600976申请日：19960222公开号：US05744225A公开日：19980428
摘要：A heat insulating board and a method for heat insulation by utilizing the samebased on a novel heat-insulation theory utilizing a heat gradient. And, this heat insulatingboard is characterized by consisting of a composite body of an opaque heat-conductingbase body positioned to face the low temperature zone and a heat conductivetransparent layer positioned to face the high temperature zone, the said transparentlayer having a heat volume and an absorption of heat of radiation smaller than the heatvolume and absorption of heat of radiation of the said base body.
申请人：KABUSHIKI KAISHA SEKUTO KAGAKU
代理机构：Wenderoth, Lind & Ponack
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