专利名称：Pump housing and a manufacturing method
therefor
发明人：MOON, SUNG-DAI申请号：EP96113450申请日：19960822公开号：EP0778096A3公开日：19981223
摘要：A pump housing and manufacturing method therefor includes a primarymolding for injecting halves of the pump housing and a secondary molding for
assembling the primary molds to each other to be installed to the interior of a secondarymetal mold and secondarily-molding the outer surface of the pump housing withoutrequiring core fabrication, installation and removal steps of the injection molding. Thus,the core fabrication and core removal steps heretofore required for an inlet or undercutare unnecessary for enabling swift mass production and lowering difficulty of working tomake the quality consistent and decrease inferior products, thereby reducing themanufacturing cost.
申请人：DAEWOO ELECTRONICS CO., LTD
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容