Method of encapsulating TFEL panels with a curable

专利名称：Method of encapsulating TFEL panels with a

curable resin

发明人：William A. Barrow,Richard Schmachtenberg,

III

申请号：US07/104166申请日：19871005公开号：US04802873A公开日：19890207

摘要：A solid filler material is used to encapsulate active TFEL components supportedby a substrate and disposed within a cavity. The cavity is created by affixing a rear coverplate to the substrate. The filler material is injected into the cavity as a liquid but cures toa solid under the influence of heat. This provides an effective moisture barrier andenhances the structural integrity of the panel rendering it immune to problems causedby changes in air pressure or caused by vibration.

申请人：PLANAR SYSTEMS, INC.

代理机构：Chernoff, Vilhauer McClung & Stenzel

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