专利名称：Method for manufacturing a conducting
substrate
发明人：Ji Young Hwang,Jiehyun Seong申请号：US14442605申请日：20131202公开号：US09715289B2公开日：20170725
专利附图：
摘要：A method for preparing a conducting substrate according to the presentinvention comprises: 1) forming a conducting pattern on a substrate; 2) forming a firstdarkening layer in at least a partial area on the conducting pattern by performing
electroplating; and 3) forming a second darkening layer in at least a partial area on theconducting pattern by dipping the conducting pattern in an oxidizer solution.
申请人：LG CHEM, LTD.
地址：Seoul KR
国籍：KR
代理机构：Dentons US LLP
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